Introduction of Bond Issue Scheme – Inside Information

The Management Board of LC Corp S.A. (“the Issuer” or “the Company”) informs that on 1 October 2018 it adopted a resolution on introducing a bond scheme under which the Company’s bonds in an amount of up to PLN 400,000,000 (hereinafter called: “the Bond Issue Scheme”) will be issued.

On 2 October 2018, the Company concluded, in connection with the Bond Issue Scheme, a Bond Issue Agreement with mBank S.A., with the registered office in Warsaw.

Under the Scheme, the Company will issue from time to time unsecured dematerialised bearer bonds. Bonds issued under the Scheme will be tendered for purchase pursuant to Article 33(2) of the Act of 15 January 2015 on Bonds (i.e. Journal of Laws [Dziennik Ustaw] of 2018, item 483).

Decisions on launching consecutive bond issues under the Scheme and the value thereof will be taken on an ongoing basis depending on whether the Company will need to obtain funding. Detailed bond issue parameters will be determined prior to the issuance of a given bond series. It may be required for the respective series of bonds to be issued under the Scheme that bonds will have to be registered in the depository maintained by Krajowy Depozyt Papierów Wartościowych S.A. (the Central Securities Depository of Poland) and introduced to an alternative trading system operated by Giełda Papierów Wartościowych w Warszawie S.A. (the Warsaw Stock Exchange) or BondSpot S.A.

The objective of the Scheme is to diversify the sources of funding and optimise the Company’s operating costs. The Scheme does not have any impact on the targets which the Company set for the overall level of the net-debt-to-EBITDA ratio.

Legal basis: Article 17(1) of the Regulation of the European Parliament and of the Council (EU) No. 596/2014 on market abuse repealing Directive 2003/6/EC of the European Parliament and of the Council and Commission Directives 2003/124/EC, 2003/125/EC and 2004/72/EC – inside information.